Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus
US6742694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2002 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Aug 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.