Apparatus for flattening a substrate and method thereof
US6742948B2 · kind B2 · utility
2Cited by
11References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J11/0005
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for flattening a substrate against a surface of a platform is provided. The method comprising positioning guides within a platform so that opposite edges of a substrate placed on the platform do not come in contact with at least one print head in close proximity over the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.