High speed, high density interconnection device
US6743049B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2002 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Jun 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.