Gel-free colloidal abrasive polishing compositions and associated methods
US6743267B2 · kind B2 · utility
18Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2002 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Oct 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Gel-free colloidal abrasive polishing compositions and associated methods for polishing (e.g., chemical mechanical polishing) are described. These abrasive polishing compositions are comprised of a surface-modified colloidal abrasive that has been modified with a boron-containing compound(s), such as boron surface-modified colloidal ceria or silica. These compositions are useful in chemical mechanical planarization (CMP) applications as well as in substrate polishing applications. These abrasive compositions are most often negatively-charged colloids, which remain as stable negatively-charged colloids even in acidic media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.