Method for partially plating on a base
US6743477B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 14, 2000 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | May 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0786
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base of synthetic resins or other materials is partially plated. The base includes not only a single base but an assembly with a number of chip bases for producing electronic and electric parts such as printed circuit board, lead frame insert molded circuit parts, etc. A method for partially plating a base by the use of a plating catalyst includes a coating process to coat a surface to be plated or not to be plated by means of a coating material selected from a water soluble polymer or hydrolyzable polymer either before or after a catalyst applying process to soak a container containing the base in a plating catalyst bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.