Flip-chip on flex for high performance packaging applications
US6743664B2 · kind B2 · utility
35Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Dec 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4623
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided including attaching an encapsulant to an integrated circuit (IC), forming a substrate from at least one layer of dielectric, attaching at least one electrical contact to the substrate, attaching a first surface of the substrate to the encapsulant so that the substrate is connected to the IC, attaching an electrical element to a second surface of the substrate, and electronically connecting the first surface of the substrate and the second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.