Thermoplastic resin composition
US6743849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Dec 25, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a thermoplastic resin composition having excellent blister resistance, which does not cause blister on the surfaces of resinous parts by passing through a reflowing oven when the resin composition is used as a resin material forming the resinous parts subjected to the surface-mount technology system, particularly, a thermoplastic resin composition high in mechanical strength such as flexural strength, weld strength and tensile elongation and excellent in moldability and friction property. The resin composition contains a polyamide resin component composed of 5 to 95% by weight of the following component (A) and 95 to 5% by weight of the following component (B):Component (A): a polyamide resin obtained by polycondensing diamine(s) including at least tetramethylenediamine with dicarboxylic acid(s) including at least adipic acid; andComponent (B): a polyamide resin obtained by polycondensing diamine(s) including at least one of 1,9-nonanediamine and 2-methyl-1,8-octanediamine with dicarboxylic acid(s) including at least terephthalic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.