Heat dissipating IC devices
US6743972B2 · kind B2 · utility
47Cited by
20References
40Claims
0Family size
Inventor
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Aug 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.