Combined laser-scribing and laser-breaking for shaping of brittle substrates
US6744009B1 · kind B1 · utility
122Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2002 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Aug 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P40/57
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of segmenting a sheet of a brittle material, comprising sequential steps of:subjecting the sheet to a first laser-based process to form a laser-scribing line extending from a surface of the sheet to a first depth below the surface;subjecting the sheet to a second laser-based process to form a laser-breaking line extending from the laser-scribing line at the first depth below the surface to a second, greater depth below the surface; andsegmenting the sheet along the thus-formed combined laser scribing + laser-breaking line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.