Wafer heating devices for use in ion implantation systems
US6744017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2002 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Jun 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a heating assembly that includes a thermally conductive, lamp-mounting block manufactured from aluminum or a similar material, which can be machined as a single-piece (e.g., unibody) block. The unibody block includes one or more networks of inner passageways bored or otherwise machined within the block for transporting one or more cooling fluids. The mounting block can also have a reflective coating on one or more of its surfaces that face the lamps to efficiently reflect heat and/or light generated by the lamps onto a desired surface, for example, a semiconductor wafer. Thermal isolation devices, e.g., pads, provide for both physical mounting of the heating lamps to the mounting block and also provide thermal isolation between the heating lamp and its electrical connections are also disclosed to protecting heat-sensitive elements of the heating assembly such as seals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.