Flip chip interconnection structure and process of making the same
US6744142B2 · kind B2 · utility
12Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2003 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a process of fabricating flip chip interconnection, a UBM layer is deposited on an I/O pad of a chip. The UBM layer includes a nickel layer. On the UBM layer is formed a tin-containing solder material. The chip is mounted on a carrier substrate by alignment of the bonding pad with a contact pad of the carrier substrate. A reflow process is performed to respectively turn the tin-containing solder material to a tin-containing solder bump and form a composite intermetallic compound on the nickel layer of the UBM to prevent its spalling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.