Burn-in board with adaptable heat sink device
US6744269B1 · kind B1 · utility
42Cited by
36References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1998 |
| Grant date | Jun 1, 2004 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.