Heat exchanger for electronic/electrical components
US6745823B2 · kind B2 · utility
14Cited by
11References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 2003 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Feb 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Both dynamic and static cooling capability for cooling electronic or electrical components on a circuit board is achieved in a heat exchanger that includes a circuit board on which the components to be cooled are mounted together with a coolant channel with a coolant inlet and a coolant outlet in heat exchange contact with the circuit board. The heat exchanger includes a container defining a coolant depot adjacent to and in heat exchange relation with the flow channel and adapted to contain a coolant to accept heat rejected by the components when coolant is not flowing in the coolant channel between the inlet and the outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.