Heat pipe loop with pump assistance
US6745830B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2003 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Jan 22, 2023 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.