Electrolytic gold plating method and apparatus therefor
US6746579B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 21, 2001 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Apr 18, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solution, and to provide an apparatus for monitoring the deterioration of the electrolytic gold plating solution.The present invention is characterized by an electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, wherein the gold plating is performed while deterioration of the plating solution is being always or intermittently detected during plating. Further, the present invention is characterized by an electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, which comprises a detecting means for always or intermittently detecting deterioration of the plating solution and a monitoring unit for displaying the deterioration degree.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.