Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board
US6746621B2 · kind B2 · utility
13Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Nov 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.