Device and method for regulating application of adhesives and/or sealants

US6746712B2 · kind B2 · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien (Henkel KGAA) · DE

Inventors

• Gunter Hoffmann · Hofheim, DE
• Volker Kels · Neuss, DE
• Joerg Hurdelbrink · Reinsdorf, DE
• Richard Scholta
• Willi Borst · Florstadt, DE
• Roland Heume · Gedern, DE

Key dates

• Filing date: Dec 31, 2002
• Grant date: Jun 8, 2004
• Expiry date: Dec 31, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B05C5/02
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.