Three dimensional thin film devices and methods of fabrication
US6746890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2002 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Aug 16, 2022 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2230/008
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods for making thin film multiple layered three-dimensional devices using two-dimensional MEMS techniques for use in a variety of applications including endovascular, endolumenal, intracranial, and intraocular medical applications. In the general method, a thin film first layer of the device material is deposited over a release layer which in turn is deposited on a substrate. An other release layer is deposited on the first device layer, with portions of the other release layer removed, leaving a pattern in the first device layer. In a similar manner a second layer of device material is formed in a pattern overlying the first device layer with portions of the two layers joined together leaving a portion of the release layer between them. The two release layers are removed and the first and second layers of the device material are formed into a three-dimensional shape suitable for the desired end-use application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.