Heat sink for electronic components
US6747865B2 · kind B2 · utility
3Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2002 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Apr 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for electronic components having a heat dissipator connected to at least one electronic component and a ventilator designed to supply the heat dissipator with air. The heat dissipator includes at least one thermally conductive plate connected to the electronic component and having a plurality of openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.