Channeled heat dissipation device and a method of fabrication
US6747873B1 · kind B1 · utility
8Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2003 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Mar 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.