Folded fin on edge heat sink
US6749009B2 · kind B2 · utility
6Cited by
8References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Feb 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink for cooling electrical or electronic devices comprises a spreader plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material comprising alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.