Liquid cooling system for processors
US6749012B2 · kind B2 · utility
27Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Apr 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling system for a processor-based system may include a housing that contains a heat exchanger, a tank, and an internal pump that pumps fluid through the heat exchanger and through a cooling plate coupled thermally to a processor to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.