Process for ultrasonic bonding
US6749704B2 · kind B2 · utility
15Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2003 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Mar 25, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2009/003
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for bonding at least two elements (10, 12) of which at least one is impregnated with a thermostable thermoplastic resin or mixtures of resins, characterized in that the elements are placed in contact by pressure members which are adapted also to transmit vibrations to at least one of the elements so as to obtain temperature rise by friction at the interface, to the operating temperature comprised within a shoulder (20), comprising a less rapid increase of shoulder corresponding to the passage from the solid to the liquid condition of the resin or of the mixture of resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.