Silane based moisture curing hot-melt adhesives
US6749943B1 · kind B1 · utility
26Cited by
14References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A moisture curable, hot melt composition is described comprising the product of reacted components, the components comprising: (a) a semi-crystalline polyol; (b) an amorphous polyol comprising secondary hydroxyl groups; (c) a secondary aminosilane endcapper comprising secondary amino functionality; (d) an isocyanate; and (e) substantially no tin. A method for the manufacture of the moisture curable, hot melt adhesive and/or sealant composition is described as well as methods for using the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.