Patent · US Expired

Process and apparatus to subdivide objects

US6750118B2 · kind B2 · utility

2Cited by

1References

14Claims

0Family size

Assignee

Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

Daniel Kray · Glückstadt, DE
Gerhard Willeke · Konstanz, DE

Key dates

Filing date	May 8, 2002
Grant date	Jun 15, 2004
Priority date	—
Expiry date	Jun 26, 2022

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC30B33/00
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A process and an apparatus used to subdivide objects (4) into slices, in particular to manufacture wafers from semi-conducting monocrystalline blocks, wherein these blocks are subdivided into slices with the help of at least one cutting tool (3), and under the influence of an etchant. Prior to completely cutting and subdividing the object (4) (ingot) into individual slices (wafers), a separating foil (12) is introduced into each cut slit (9) to separate the slices. This efficiently prevents the resultant wafers from sticking together. The individual separation of the wafers is thus accomplished right when the cutting process takes place so that the necessary number of process steps to manufacture silicon wafers is reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.