Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method
US6750475B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2000 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | May 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An oxide film is formed on an insulating substrate by means of a wet type film forming technique such as a sol-gel method, a chemical deposition method or a liquid phase deposition method. Next, the oxide film is patterned according to the shape of interconnections. Then, a metal film made of Ni is formed on an oxide film pattern by such a wet type film forming technique as a wet type plating method. Further, a metal film made of Au that has a low resistance is laminated on the metal film made of Ni by electroless plating, and a metal film made of Cu that has a low resistance and is low cost is laminated on the Au film by electroplating. Thus, by the above method for manufacturing electric interconnections, a large-area interconnection substrate for a display device and an image detector is able to be fabricated at low cost without using a vacuum film forming apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.