Temperature compensated crystal oscillator and method of manufacturing the same
US6750729B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | May 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L1/028
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A temperature compensated crystal includes a crystal package including a package board and a crystal oscillating piece, conductive patterns for constituting a temperature compensating circuit formed on a surface of the package board, exterior terminals formed at corners of the board, temperature compensating components formed on the surface of the board, and resin molded part enveloping the surface of the board. With a lower surface of a crystal package serving as a component mounting area, it is not necessary to provide an additional printed circuit board required for mounting of temperature compensating components, and it is possible to provide a compact TCXO having a surface area corresponding to that of a crystal package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.