Hot melt material application system with high temperature pressure monitoring and heated recirculating manifolds
US6752323B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B9/002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hot melt high temperature material application system with application device pressure monitoring and heated recirculating manifold uses high temperature pressure transducers with each application device such as spray guns to monitor hot melt material application. A material supply line fitting has a calibrated orifice at the interface with a device manifold associated with each application device. In another embodiment, the calibrated orifice is located in a fluid passageway of the device manifold. The calibrated orifice corresponds in size to the opening of a nozzle of the application device. Heated recirculating manifolds are combined with hot melt material supply systems to provide uniform pressure to multiple application devices, and to recirculate material back through the supply system. Each recirculating manifold includes a heater, pressure regulator, and a recirculation path. The manifolds may be directly or remotely connected to one or more hot melt material supply systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.