Embossing methods
US6752952B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 1, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Aug 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the method far embossing a substrate, includes: heating a first substrate to a temperature above a glass transition temperature; preheating and maintaining a mold at a mold temperature below the glass transition temperature; introducing the heated substrate to the preheated mold; compressing the heated substrate in the mold; cooling the compressed substrate; and removing the cooled substrate from the mold. In another embodiment, the method for embossing a substrate, includes: heating a first substrate to a temperature above a substrate surface glass transition temperature; preheating a mold to a mold temperature of up to about 30° C. above the substrate surface glass transition temperature; introducing the heated substrate to the preheated mold; compressing the heated substrate in the mold; cooling the compressed substrate; and removing the cooled substrate from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.