Heat shrinkable film structures with improved sealability and toughness
US6753054B1 · kind B1 · utility
13Cited by
7References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1999 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Nov 19, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A multi-layer packaging film comprising layers having varying degrees of cross-linking when subjected to electron beam (EB) radiation. The outer layer has a high degree of cross-linking to improve the adhesion, strength, toughness and heat resistance of the film and the inner layer has a low degree of cross-linking to improve the sealability. Bags made from the multiple layer films are especially useful for shrink packaging, and particularly for shrink packaging of meats having large cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.