Resist removal from patterned recording media
US6753130B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Mar 17, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/82
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for patterning a carbon-containing substrate utilizing a patterned layer of a resist material as a mask and then safely removing the mask from the substrate without adversely affecting the substrate, comprising sequential steps of:(a) providing a substrate including a surface comprising carbon;(b) forming a thin metal layer on the substrate surface;(c) forming a layer of a resist material on the thin metal layer;(d) patterning the layer of resist material;(e) patterning the substrate utilizing the patterned layer of resist material as a pattern-defining mask; and(f) removing the mask utilizing the thin metal layer as a wet strippable layer or a plasma etch/ash stop layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.