Topside active optical device apparatus and method
US6753199B2 · kind B2 · utility
1Cited by
40References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Jun 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of integrating a topside optical device, having electrical contacts on a top side, with an electronic chip having electrical contacts on a connection side, involves creating a trench, defined by a wall, from the top side of a wafer containing the topside optical device into a substrate of the wafer, making a portion of the wall conductive by applying a conductive material to the portion; and thinning the substrate to expose the conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.