Wafer heating apparatus
US6753507B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Oct 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/265
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a ceramic heater having a plate-like body made of a ceramic, heating element in one main face of the plate like body, and an electric supply portion to be electrically connected with the heating element, it has been a problem that the temperature is uneven if bent portions are formed in heat generating patterns. The ceramic heater simultaneously satisfying the following: 0.15≦S≦0.85, 0.3≦P≦6.71×S2+1.52, and 0.3≦G≦6.71×(1−S)2+1.55, in which the reference character S1 denotes the surface area of the heating element in optional 10 mm square region of the effective heat generation area having the heating element therein; the surface ratio S denotes S=S1/100 mm2, the reference character P denotes the width of the heating element: and the reference character G denotes the gap between the heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.