Half-bridge subassembly
US6753674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Dec 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Half-bridge assembly for switching electrical power, wherein at least two semiconductor switches are connected in series forming a half-bridge; each semiconductor switch comprises a control input, the first semiconductor switch comprises a first power terminal which can be connected with a high voltage potential; the second semiconductor switch comprises a second power terminal which can be connected with a low voltage potential; a second power terminal of each first semiconductor switch is connected with a first power terminal of the respective second semiconductor switch; each of the semiconductor switches comprises a free-wheeling diode which is located parallel to both power terminals of the respective semiconductor switch; and a Schottky diode is connected in parallel to each free-wheeling diode, each semiconductor switch with its free-wheeling diode and each Schottky diode is connected with a heat sink in a heat conductive manner, with the thermal resistance between each Schottky diode and the heat sink being dimensioned larger than the thermal resistance between each free-wheeling diode and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.