Heat dissipating apparatus for circuit boards
US6754077B2 · kind B2 · utility
15Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2003 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | May 5, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus for circuit boards includes a heat transfer plate, at least one heat transfer tube located on the heat transfer plate, a first radiator located on the heat transfer plate, a shell mounted onto the heat transfer plate, an airflow generator located in the shell, at least one latch member latching on the heat transfer plate, and a filter located on the shell. The heat dissipation apparatus is mounted onto a circuit board (such as, but not limited to, interface card, processor circuit board) for discharging heat generated by various elements to ensure stable operations of the elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.