Chemical mechanical polishing of nickel phosphorous alloys
US6755721B2 · kind B2 · utility
12Cited by
7References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2002 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Mar 24, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respectively and optionally an organic carboxylic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.