Barrier layer for electrical connectors and methods of applying the layer
US6755958B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2001 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Dec 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the group consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, and rhodium. An outer finish layer is coated over the barrier layer, and the finish layer is selected from the group consisting of tin, gold, palladium, platinum, silver, and alloys thereof, so that the electrical contact resistance of the treated contact member does not exceed about 10 milliohms at 100 grams contact force over a period of at least 1000 hours, and at a temperature of at least 150 degrees C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.