Method for manufacturing cockpit-type instrument panels
US6756004B2 · kind B2 · utility
32Cited by
28References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2002 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Aug 14, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60Y2410/12
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a modular plate for a cockpit-type instruments panel includes molding a modular plate having an outer peripheral rim and a plurality of apertures in a first shot of an two-shot injection molding process, and then overmolding a plurality of seals about the outer rim and at least one aperture during a second shot of the two-shot process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.