Method for producing via-connections in a substrate and substrate equipped with same
US6756304B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2002 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Jan 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating conducting through-connections in a substrate, and a substrate equipped with such connections. The method of fabricating conducting through-connections between the front face and the rear face of a substrate hollows into the substrate, from the rear-face side, cavities having a depth and a cross-section that are defined so as to delimit studs of defined cross-section, which are intended to provide for electrical conduction between the front and rear faces, and filling in the cavities with a dielectric material. The substrate is equipped with conducting through-connections between its front face and its rear face. The conducting connections are provided by way of studs delimited by cavities filled in with a dielectric material. Such a method and substrate may find application, in particular, to substrates used for the fabrication of microsensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.