Electronic device and its manufacturing method
US6756670B1 · kind B1 · utility
5Cited by
24References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2000 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Oct 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.