Heat sink and package surface design
US6757170B2 · kind B2 · utility
17Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package, or a protrusion that maintains bond line thickness between the heat sink and package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.