Optical fiber arrays with precise hole sizing
US6757475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2003 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Jun 12, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3652
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of making and an etchable wafer substrate for use in making optical fiber array plates includes forming a progressively increasing series of metrology holes when the plate holes are formed. The variation between designed plate hole diameter and actual plate hole diameter is determined by sequentially inserting a probe of known designed diameter into the metrology holes to determine the two size-adjacent metrology holes variation. The plate hole diameter can be determined by comparing one of the size-adjacent metrology hole diameter with the respective art work metrology hole diameter. Plate hole diameters can then be corrected for variation with further processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.