Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation
US6758609B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Jul 23, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3803
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In-situ and post-cure methods of joining optical fibers and optoelectronic components are provided. An in situ method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with non-ionizing radiation in RF/microwave energy to rapidly cure the resin. A post-cure method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that the sig…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.