Patent · US Expired

System and a method for plating of a conductive pattern

US6758958B1 · kind B1 · utility

2Cited by

4References

6Claims

0Family size

Assignees

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW · BE
Siemens Aktiengesellschaft · DE

Inventors

Filip Van Steenkiste · Machelen, BE
Kris Baert · Leuven, BE
Walter Gumbrecht · Herzogenaurach, DE
Philippe Arquint · Herzogenaurach, DE

Key dates

Filing date	Apr 16, 2001
Grant date	Jul 6, 2004
Priority date	—
Expiry date	Apr 16, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S428/901
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention presents methods and systems for plating conductive patterns which at least result in a high uniformity and avoid parasitical plating effects. A plating system is disclosed for plating conductive patterns formed at a first surface of a substrate. The system is such that exposure surfaces not to be plated is inhibited. A first electrode of the system is immersed in the plating solution while the second electrode is in contact with another than the first surface of the substrate. The conductive patterns to be plated are temporarily electrically connected with the second electrode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.