System and method for minimizing cure-induced residual stress in an epoxy impregnated ignition coil
US6758993B2 · kind B2 · utility
1Cited by
22References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | May 28, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2063/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method is disclosed that uses an empirically-derived thermal transfer function for an ignition coil taken with respect to an ambient temperature and responsive internal temperatures. The system combines the transfer function with a minimum cure-induced stress profile, in order to obtain a time-temperature profile for minimizing cure-induced residual stress in an epoxy resin impregnated ignition coil. An accelerated minimal-stress profile is obtained by increasing an initial gel isotherm temperature of the above-mentioned time-temperature profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.