Pressure type fingerprint sensor fabrication method
US6759264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2003 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1306
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a fabrication method of a pressure type fingerprint sensor, which uses the commercial integrated circuit process to form the sensor and the processing circuit together on the same chip. The present invention comprises a plurality of capacitive pressure sensors arranged in a 2-D array and applies the charge sharing principle to each capacitive pressure sensor for signal reading. The main structure of each pressure sensor is a pair of plate electrodes with an air gap between them to form a plate sensor capacitor, wherein the plate electrodes comprise a floating electrode and a fixed electrode. When the finger ridge contacts the floating electrode, the pressure from the finger changes the spacing of the air gap so as to change the capacitance of the plate sensor capacitor. The 2-D sensor array can read the 2-D pressure distribution pressed by the finger ridge to construct the fingerprint pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.