System for laser shock processing objects to produce enhanced stress distribution profiles
US6759626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Jul 29, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D10/005
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Various laser shock processing systems are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One system is configured to simultaneously irradiate a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Another system irradiates opposite sides of the workpiece at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Another system simultaneously irradiates opposite sides of the workpiece using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Another system simultaneously irradiates opposite sides of the workpiece to form a set of laterally offset laser shock peened surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.