Thermal imaging system for detecting defects
US6759659B2 · kind B2 · utility
27Cited by
23References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2003 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal imaging system for detecting cracks and defects in a structure. An ultrasonic transducer is coupled to the structure through a malleable coupler. Ultrasonic energy from the transducer causes the defects to heat up, which is detected by a thermal camera. A control unit is employed to provide timing and control for the operation of the ultrasonic transducer and the camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.