Miniature device with increased insulative spacing and method for making same
US6759734B2 · kind B2 · utility
0Cited by
6References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Mar 14, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0178
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention provides a miniature device that comprises a grounded layer, an insulative layer overlying the grounded layer and a conductive layer overlying the insulative layer wherein the insulative spacing between the conductive and grounded layers is increased so as to inhibit electrical shorting between the conductive layer and grounded layers. A method of making miniature devices is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.