Patent · US Expired

Array of dice for testing integrated circuits

US6759865B1 · kind B1 · utility

12Cited by
13References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 30, 2002
Grant dateJul 6, 2004
Priority date—
Expiry dateJul 30, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2889
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

In one embodiment, a test interface for testing integrated circuits includes an array of dice. A removable electrical connection (e.g., an interposer) may be coupled between the array of dice and a wafer containing multiple dice to be tested. The removable electrical connection allows electrical signals to be transmitted between the array of dice and the wafer. The test interface may be used in conjunction with a tester.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.